1. 2. 3. material content data sheet sales product name bsc030p03ns3 g issued 4. august 2015 ma# ma001403694 package pg-tdson-8-1 weight* 122.81 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 5.418 4.41 4.41 44113 44113 leadframe non noble metal iron 7439-89-6 0.038 0.03 308 inorganic material phosphorus 7723-14-0 0.011 0.01 92 non noble metal copper 7440-50-8 37.762 30.75 30.79 307476 307876 wire non noble metal copper 7440-50-8 0.023 0.02 0.02 185 185 encapsulation organic material carbon black 1333-86-4 0.078 0.06 634 plastics epoxy resin - 5.528 4.50 45013 inorganic material silicondioxide 60676-86-0 33.324 27.13 31.69 271344 316991 leadfinish non noble metal tin 7440-31-5 1.470 1.20 1.20 11968 11968 plating noble metal silver 7440-22-4 0.166 0.13 0.13 1348 1348 solder noble metal silver 7440-22-4 0.101 0.08 824 non noble metal tin 7440-31-5 0.081 0.07 660 non noble metal lead 7439-92-1 3.868 3.15 3.30 31495 32979 clip plating noble metal silver 7440-22-4 1.289 1.05 1.05 10499 10499 heatspreader non noble metal iron 7439-89-6 0.011 0.01 92 inorganic material phosphorus 7723-14-0 0.003 0.00 28 non noble metal copper 7440-50-8 11.320 9.22 9.23 92174 92294 heat sink clip non noble metal iron 7439-89-6 0.022 0.02 182 inorganic material phosphorus 7723-14-0 0.007 0.01 55 non noble metal copper 7440-50-8 22.292 18.15 18.18 181510 181747 *deviation < 10% sum in total: 100.00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. this product is in compliance with eu directive 2011/65/eu (rohs) and contains pb according rohs exemption 7a, lead in high melting temperature type solders. company infineon technologies ag address 81726 mnchen internet www.infineon.com
|
